I. Features: 
 Sealant, silicone sealant, sealant electronics, electronic fixed plastic, silicone, silicone, neutral cure silicone rubber, the vast majority of materials are good adhesive strength and sealing performance, and good high and low temperature performance, temperature range is -60 ℃ ~ 200 ℃, excellent electrical performance, moisture-proof anti-corona, shock resistant, widely used in industrial and electrical and electronic bonding and sealing. 
 Sealant, silicone sealant, sealant electronics, electronic fixed plastic, silicone, silicone, one-component, fast curing, non-corrosive silicone adhesive sealant. It uses moisture in the air, the formation of elastic silicone rubber vulcanization. For metals, including copper, plastics, ceramics, glass and other non-corrosive with excellent adhesion, and without the use of primer. 

 Second, one-component room temperature curing silicone performance test data and the specific uses that 
 Model X-505 
 Appearance of the transparent flow 
 Dry time (min) 5-25 
 Tensile Strength (mpa) 4 
 Temperature (℃) -60 ~ 200 
 Elongation (%) ≥ 80 
 Shear strength (mpa) 4 
 Peel Strength KN / m ≥ 0.5 
 Shore hardness (A) ≥ 25 
 Surface resistivity (Ω) 5 × 1012 
 Volume resistivity (Ω / cm) 2.5 × 1014 
 Dielectric constant (LMHz) ≤ 3.7 
 Power value dielectric loss angle is (10/HZ) 2 × 10-3 
 Dielectric Strength (KV / mm) 15 
 Notes for use of glass, equipment, instruments, medical equipment, or small electronic components 
 Third, the use of technology 
 1, clean the surface: The surface is sticky or coated finishing clean, remove rust, dust and oil and so on. 
 2, the sizing: cut open with a blade tip of the front part, put beak, glue gun with a squeeze pushed to the surface has been cleaned, so that distribution will be a fixed closed surface can be glued. 
 3, the cure: to be glued or sealed parts in the air, let the natural cure. Curing process is a cure from the surface to the internal process within 24 hours (wet and 50% relative humidity, temperature) glue curing depth of 2 ~ 4mm, if the position deeper, especially in the air is not easily accessible to the site , completely cured of the time will be extended, if the temperature is low, the curing time will be extended. In for further processing or packaging components to be bonded, it is recommended users wait long enough to make the bonding integrity of the firm and not be affected.