Potting 
 Silicone encapsulants features: the depth of cure and the curing time can be adjusted. 
 Use of electronic potting materials: electronic components, circuit boards and a large area of bonding adhesive seals, sealing, coating, sealing. Electronic potting materials to use: first by bonding the sealing surface clean, then the proportion of the two products in accordance with the provisions of mixing stir well to operate. Electronic potting Note: A, B components of the operating tools are not mixed, and after the cleaning operation to be the next use.